Special Adhesive Tapes

Conductive Adhesive Tapes

Product Descriptions:

Product Applications:

 

Conductive tape solutions, applied to smart phones, tablets, laptops, smart TVs, wearable devices and other smart electronic devices


• Pasting of FPC and shell

• Camera module grounding
• Smart watch sensor fixed
• Sensor ground
• Void filling: suitable for applications that require single-sided conductive filling, while requiring compressibility and/or wear resistance

 

 

Features/Benefits

 

• You only need to choose the more important performance, such as: adhesion, conductivity or both, we can provide you with the best conductive tape solution.


• Provides the best conductivity in the double-sided conductive adhesive, even in harsh environmental conditions, still has excellent conduction performance.


• Conductive shielding has a wide range of applications, with different requirements for conductivity, viscosity and design. Our single-sided conductive adhesive series can meet the latest shielding and appearance requirements. Shielding applications have high requirements for adhesion, rebound resistance, and EMI shielding characteristics. We provide you with special tape solutions to meet today's demanding design requirements.


• The matt black series of conductive adhesives meet the latest appearance and electromagnetic shielding design requirements. There are two different substrates (woven and copper foil) to better meet the individual requirements for adhesion, shielding and appearance.


• The copper foil series has the best adhesion and anti-rebound performance in the conductive adhesive series. The copper foil base material ensures high electromagnetic shielding and thermal conductivity.


• Single-sided conductive foam glue can meet the performance requirements for shielding, grounding and gap filling. This series has excellent shock resistance and cushioning properties. At the same time, depending on the type of foam, it has excellent conformability, resilience or ultra-high abrasion resistance.