T630 Thermally Conductive Gels
Product features
Typical Applications:
● Automotive electronic control units (ECUs)
● Engine control
● Transmission control
● Braking/traction control
● Automotive electronic control units (ECUs)
● Power conversion equipment
● Power supplies and uninterruptible power supplies
● Power semiconductors
● MOSFET arrays with common heat sinks
● Televisions and consumer electronics
Features / Benefits:
Duxerials1745 series thermal conductive adhesive is made of silicone resin as the base material, adding thermal conductive fillers and bonding materials. It has excellent weather resistance, low mechanical stress and high compression deformation performance, superior dielectric properties, and no volatiles. It has low consistency and good construction performance, with self-adhesiveness, suitable for filling in irregular gaps.
▪ Low thermal resistance;
▪ Excellent environmental resistance;
▪ Low shrinkage, meeting process requirements during precision period, and having good water resistance;
▪ High material stability, slow thermal conductivity decay, meeting the long-term use requirements under thermal cycling conditions.
Properties
characteristic | T631 | T632 | T633 | T634 | standard test |
colour | gray | Light red | Light blue | Light blue | Visually |
Viscosity after mixing | 40 ~ 50 Pa.S | 40 ~ 60 Pa.S | 40 ~ 70 Pa.S | 80 ~ 120 Pa.S | ASTM D2196 |
Thermal conductivity | 1.8 W/M.K | 2.0 W/M.K | 3.0 W/M.K | 4.0 W/M.K | ASTM D5470 |
Minimum filling thickness | 0.05 mm | 0.05 mm | 0.1 mm | 0.1 mm | ASTM-D374 |
Glue output (0.6 atmospheres/3S) | 0.7~1.2 G | 0.7~1.2 G | 0.8~1.4 G | 0.6~1.0 G | / |
Breakdown voltage (1mm) | ≥5 KV/mm | ≥5 KV/mm | ≥5 KV/mm | ≥5 KV/mm | ASTM D149 |
proportion | 1.85 ± 0.2 g /cm3 | 2.6 ± 0.2 g /cm3 | 2.85 ± 0.2 g /cm3 | 3.02 ± 0.2 g /cm3 | ASTM D792 |
Operating temperature | -40~200 ℃ | -40~200 ℃ | -40~200 ℃ | -40~200 ℃ | EN344 |
Volume resistance | ≥10 12 Ω-CM | ≥10 12 Ω-CM | ≥10 12 Ω-CM | ≥10 12 Ω-CM | ASTM D257 |
Flammability rating | V0 | V0 | V0 | V0 | UL_94 |
When the surface is dry (25℃) | 20 ~ 30 MIN | 20 ~ 30 MIN | 20 ~ 30 MIN | 20 ~ 30 MIN | / |
Curing time (25℃) | ≥50 MIN | ≥50 MIN | ≥50 MIN | ≥50 MIN | / |
Curing time (60℃) | 10 ~ 15 MIN | 10 ~ 15 MIN | 10 ~ 15 MIN | 10 ~ 15 MIN | / |
Curing time (100℃) | 5 ~ 10 MIN | 5 ~ 10 MIN | 5 ~ 10 MIN | 5 ~ 10 MIN | / |
Note: The data recorded on this website are representative values rather than guaranteed values. To improve product performance, specifications are subject to change without notice. The use of the product recorded in this website is just an example. The product can have a variety of different application scenarios and environments, which are beyond our control. Therefore, whether the product is suitable for your production process and conditions, you need to make full use of it before using it. Evaluate to confirm whether its performance and effect are in line with expectations. For Industries that need to be considered safe, please test and confirm their safety in advance. In addition, the company does not guarantee that the purposes recorded on this website will not infringe any patents. Before using this product, please carefully read the explanatory text and safety data sheet (MSDS) marked on the main body of the product. This product is manufactured for general industrial Industries. Do not use for medical purposes. The product may precipitate during storage. This is a normal phenomenon. Please mix well before use and strictly follow the product storage and transportation instructions. In order to obtain the best performance, the bonding surface should be clean, dry and free of grease. For high-strength structural bonds, special surface treatment can increase bond strength and durability. The material taken out of the container may be contaminated during use. Do not put the material back into the original container. Duxerials® cannot be held responsible for products that are contaminated or stored under non-instructed conditions. |