8329 Thermally Conductive Adhesives
Product features
Typical Applications:
●Thermal conductive adhesive Apply in COB, photovoltaic, semiconductor and other electronic and electric industry which have a higher request about the thermal conductivity.
Thermally conductive adhesives are dispensable formin-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet.
Features / Benefits:
● Dispensable form-in-place gap filling, potting, sealing, and encapsulating
● Excellent blend of high thermal conductivity, flexibility, and ease of use
● Thermal conductive adhesive glue with strong adhesion and do not need screw;
● Conformable to irregular shapes without excessive force on components
Properties
