Thermal Material

T635 Thermally Conductive Gels

Product features

Typical Applications:

 

T635 THERM-A-GAP Gels are highly conformable, pre-cured, single-component compounds. The cross-linked gel structure provides superior long-term thermal stability and reliable performance. These unique materials result in much lower mechanical stress on delicate components than even the softest gap-filling sheets. They are ideal for filling variable gaps between multiple components and a common heat sink.

 

Automotive electronic control units (ECUs)

Engine control

Transmission control

Braking/traction control

Automotive electronic control units (ECUs)

Power conversion equipment

Power supplies and uninterruptible power supplies

Power semiconductors

MOSFET arrays with common heat sinks

Televisions and consumer electronics

 

Features / Benefits:

 

T635 Thermally Conductive Gelswith 2.0~4.5W/m.k thermal conductivity;

Fully cured

Highly conformable at low pressures

No refrigeration, mixing, or filler settling issues in storage

 

 

Properties

Duxerials1710 Series thermal conductive silica gel