Thermal Material

974 Thermally Conductive Gap Filler Pads

Product features

Typical Applications:

 

Telecommunications equipment

LEDs lighting, M/B, P/S, Heat Sink, LCD-TV, Notebook PC;

Consumer electronics

Automotive electronics (ECUs)

Power conversion

Desktop computers, laptops, servers

Vibration dampening

Memory modules

Handheld devices

Power semiconductors

 

Features / Benefits:

Ultra Soft and High Compressibility

3.5 W/m.k Thermal Conductivity

Low Thermal Impedance

● UL94 V0 Recognized

High tack surface reduces contact resistance

 

Properties

9700 Series Thermal Conductive Pad