Thermal Material

6006 Thermally Conductive Potting

Product features

Typical Applications:

● Automotive electronic control units (ECUs)

● Engine control

● Transmission control

● Braking/traction control

● Automotive electronic control units (ECUs)

● Power conversion equipment

● Power supplies and uninterruptible power supplies

● Power semiconductors

● MOSFET arrays with common heat sinks

● Televisions and consumer electronics

Features / Benefits:

Duxerials3000 series of products is the liquid siloxane complex mechanically or manually into the device equipped with electronic components, lines, curing at room temperature or heating conditions to become excellent performance of thermoset polymer insulation materials, the process used in the liquid siloxane complex is the sealing glue

▪ low viscosity, good leveling, suitable for complex electronic accessories and LED potting

▪ the toughness after curing is good, the impact resistance is good

▪ heat resistance, moisture resistance, cold resistance is excellent, after application can extend the life of electronic accessories

▪ plus molding, can be cured at room temperature and heating

▪ has excellent moisture and water resistance.

Properties

Uncured characteristics (25℃/70%RH)	6006-3300	6006-3400	6006-3700	6006-3800	standard test
colour	white	A: Black / B: White	white	white	Visually
Viscosity	A：8000 / B：8500	A：4000 / B：3800	A：7000 / B：4500	10000	ASTM D445-04
Duxerials potting glue Characteristics after curing (25 ℃/RH 70%)
hardness	50-70 Shore 00	50-70 Shore 00	40-60 Shore 00	40-60 Shore 00	ASTM D2240
Impact strength	＞7 g /cm²	＞7 g /cm²	＞7 g /cm²	＞7 g /cm²	ASTM D412-1998A
Water absorption rate 24Hrs	<0.05%	<0.05%	<0.05%	<0.05%	GB/T5486.3
Bending strength	＞80 kg/cm²	＞80 kg/cm²	＞80 kg/cm²	＞80 kg/cm²	ASTM D412-1998A
Thermal Conductivity	1.0 W/M.K	0.7 W/M.K	0.8 W/M.K	1.0 W/M.K	ASTM D5470
Oxygen Index	＞30	＞30	＞30	＞30	GB2406-80
Volume resistance	≥1.0ｘ10 ¹⁵ Ω · CM	≥1.0ｘ10 ¹⁵ Ω · CM	≥1.0ｘ10 ¹⁵ Ω · CM	≥1.0ｘ10 ¹⁵ Ω · CM	ASTM D257
Dielectric strength	≥10 KV/mm	≥10 KV/mm	≥10 KV/mm	≥10 KV/mm	ASTM D149
Operating temperature	-40~200 ℃	-40~200 ℃	-40~200 ℃	-40~200 ℃	EN344
Operating time	1-2 Hrs	0.5 Hrs	1-2 Hrs	0.5 Hrs	/
Full curing time	6 hrs (25 ℃) 10 ～ 15 min (120 ℃)	Hr 6 Hrs (25 ℃) 5 ～ 10 min (120 ℃)	A：＞6 Hrs(25℃) B：10～15 min(120℃)	A：＞6 Hrs(25℃) B：5～10 min(120℃)	/
Flammability rating	V0	V0	V0	V0	UL 94
Note: The data recorded on this website are representative values rather than guaranteed values. To improve product performance, specifications are subject to change without notice. The use of the product recorded in this website is just an example. The product can have a variety of different application scenarios and environments, which are beyond our control. Therefore, whether the product is suitable for your production process and conditions, you need to make full use of it before using it. Evaluate to confirm whether its performance and effect are in line with expectations. For Industries that need to be considered safe, please test and confirm their safety in advance. In addition, the company does not guarantee that the purposes recorded on this website will not infringe any patents. Before using this product, please carefully read the explanatory text and safety data sheet (MSDS) marked on the main body of the product. This product is manufactured for general industrial Industries. Do not use for medical purposes. The product may precipitate during storage. This is a normal phenomenon. Please mix well before use and strictly follow the product storage and transportation instructions. In order to obtain the best performance, the bonding surface should be clean, dry and free of grease. For high-strength structural bonds, special surface treatment can increase bond strength and durability. The material taken out of the container may be contaminated during use. Do not put the material back into the original container. Duxerials® cannot be held responsible for products that are contaminated or stored under non-instructed conditions.