Products
9902 Series thermal conductive pad
Features:
● Ultra Soft and High Compressibility;
● 7.0 W/m.k Thermal Conductivity;
● Low Thermal Impedance;
● UL94 V0 Recognized;
● Low thermal resistance and superior thermal conductivity;
Uses:
● Electronic Components: IC, CPU, MOS;
● LED, M/B, P/S, Heat Sink, LCD-TV, Notebook PC;
● PC, Telecom Device, Wireless Hub etc;
9900 Series thermal conductive pad
Features:
● Ultra Soft and High Compressibility;
● 5.0 W/m.k Thermal Conductivity;
● Low Thermal Impedance;
● UL94 V0 Recognized;
● Low thermal resistance and superior thermal conductivity;
Uses:
● Electronic Components: IC, CPU, MOS;
● LED, M/B, P/S, Heat Sink, LCD-TV, Notebook PC;
● PC, Telecom Device, Wireless Hub etc;
● DDR Ⅱ Module/DVD Application/Hand-set Application etc.
9600 Series thermal conductive pad
Features:
● Ultra Soft and High Compressibility;
● 3.0 W/m.k Thermal Conductivity;
● Low Thermal Impedance;
● UL94 V0 Recognized;
Uses:
● Electronic Components: IC, CPU, MOS;
● LED, M/B, P/S, Heat Sink, LCD-TV, Notebook PC;
● PC, Telecom Device, Wireless Hub etc;
● DDR Ⅱ Module/DVD Application/Hand-set Application etc.
Fire-extinguishing thermal pad 900 series
Features:
● Fire-extinguishing thermal pad Ultra Soft and High Compressibility；
● 1.0~5.0 W/m.k Thermal Conductivity；Self tacky；
● Low thermal impedence；V-0 Recnogizned；
● With expansive fire-fighting capabilities；
Uses:
1710 Series thermal conductive silica gel
Features:
● T635 Thermally Conductive Gelswith 2.0~4.5W/m.k thermal conductivity;
● Low thermal resistance;
● Low shrinkage rate, meet the process requirements of precision devices, excellent water resistance;
● High material stability, slow-speed thermla conductivity attenuation, meet the long-term use requirements under thermal cycling conditions;
Uses:
Widely used in all kinds of electronic products, such as transistors, CPU assembly, thermistor, temperature sensors, automotive electronics parts, car refrigerator, power modules, printers and so on.
5912 Double-Sided Thermal Tapes
Features:
● Excellent workability and processability
● thermal, dielectric, and flame retardant properties
● Low Thermal Impedance;
● Low thermal resistance and superior thermal conductivity;
Uses:
● Electronic components: IC, CPU, MOS；
● LED, M/B, PS, HEAT SINK, LCD-TV, NB, PC etc;
● DDRLL Module、DVD Industries etc.
8329 Thermally Conductive Adhesivesglue
Features:
● Thermal conductive adhesive glue bicomponent epoxy non-solvent adhesive with low thermal resistance;
● Room temperature curable with low shrinkage, can meet the technology requirement of precision,and have apreferable waterproof;
● Thermal conductive adhesive glue with strong adhesion and do not need screw;
● High stability and slow in thermal conductivity, can be long-term use under the condition of meet the need of thermal cycle.
Uses:
Thermal conductive adhesive glue apply in COB, photovoltaic, semiconductor and other electronic and electric industry which have a higher request about the thermal conductivity.
High strength thermal silicone pad
Features:
● 0.8~1.0 W/m.k Thermal Conductivity；Self tacky；
● Low thermal impedence；V-0 Recnogizned；
● Ultra Soft and High Compressibility；
● With expansive fire-fighting capabilities；
Uses:
Features:
● Thermal grease with low oil departure degree;
● Excellent thermal conductivity;
● Thermal grease with electrical insulation;
● High temperature resistance;
● Thermal grease with low consistency and good construction performance;
Uses:
Features:
● Low viscosity, good leveling, suitable for complex electronic parts and LED potting;
● After curing good toughness, good impact resistance;It has excellent moisture, water effect;
● Plus forming, and heat curing at room temperature;
Uses:
9400 Series thermal conductive pad
Features:
● Ultra Soft and High Compressibility;
● 2.0 W/m.k Thermal Conductivity;
● Low Thermal Impedance;
● UL94 V0 Recognized;
Uses:
9500 Series thermal conductive pad
Features:
● Ultra Soft and High Compressibility;
● 2.5 W/m.k Thermal Conductivity;
● Low Thermal Impedance;
● UL94 V0 Recognized;
Uses:
9800 Series thermal conductive pad
Features:
● Ultra Soft and High Compressibility;
● 4.0 W/m.k Thermal Conductivity;
● Low Thermal Impedance;
● UL94 V0 Recognized;
Uses:
9901 Series thermal conductive pad
Features:
● Ultra Soft and High Compressibility;
● 6.0 W/m.k Thermal Conductivity;
● Low Thermal Impedance;
● UL94 V0 Recognized;
● Low thermal resistance and superior thermal conductivity;
Uses:
091207 series natural graphite
Features:
091207 series of natural graphite is a natural mineral, generally formed in high temperature geological conditions, widely distributed in metamorphic deposits, by rich in organic matter or carbon sedimentary rock by regional deterioration.
Uses:
Features:
▪ thermal conductivity is 1000-1900 W/M.K;
▪ flexible flakes, can be processed into a variety of shapes, good bending performance;
▪ density is 1.6-2.1 g/cm3 (approximately 1/3-3/4 of aluminum or 1/5-1/4 of copper);
▪ low resistance for electromagnetic shielding;
Uses:
1301 Single-component thermal adhesive
Features:
▪ thermal conductivity: 1.0 W/M.K;
▪ de-alcohol type;
▪ table drying time is short;
▪ vulcanization is non-corrosive to metals;
▪ thermal conductivity, fixed, moisture-proof, shock-proof, insulation and other effects and can withstand the impact of hot and cold changes;
Uses:
Features:
▪ low viscosity, good leveling, suitable for complex electronic accessories and LED potting;
▪ the toughness after curing is good, the impact resistance is good;
▪ heat resistance, moisture resistance, cold resistance is excellent, after application can extend the life of electronic accessories;
▪ plus molding, can be cured at room temperature and heating;
▪ has excellent moisture and water resistance.
Uses:
Features:
▪ has low oil separation, high and low temperature, water, ozone, climate aging;
▪ can be used for a long time at temperatures of -40℃ - 150℃;
▪ thermal grease has excellent thermal conductivity, electrical insulation, stability of use, low consistency and good construction performance.
Uses:
1900 series thermal conductive adhesive
Features:
▪ Two-component silica gel, ultra-low thermal resistance, thermal resistance ≤0.09 cm²·℃/w；
▪ Curing at room temperature, low shrinkage, meeting the process requirements of precision period；
▪ Has good water resistance；
▪ Super adhesion, saving screws；
▪ High material stability, slow thermal conductivity decay, meeting the long-term use requirements under thermal cycling conditions.
Uses:
1740 series two-component silicone gel
Features:
▪ Low thermal resistance;
▪ Excellent environmental resistance;
▪ Low shrinkage, meeting process requirements during precision period, and having good water resistance;
▪ High material stability, slow thermal conductivity decay, meeting the long-term use requirements under thermal cycling conditions.
Uses:
1710 series one-component thermal conductive silicone gel
Features:
▪ 8.0 W/M.K thermal conductivity;
▪ low thermal resistance;
▪ Low shrinkage;
▪ Satisfy the process requirements of the precision period, and have good water resistance;
▪ High material stability, slow thermal conductivity decay, meeting the long-term use requirements under thermal cycling conditions.
Uses:
Thermal conductivity silica gel sheet (1~ 15W)
Features:
▪ Soft, good compressibility;
▪ 1 ~ 15.6 W/M.K thermal conductivity;
▪ Low thermal resistance;
▪ Fire rating reaches UL-94 V0.
Uses:
Features:
1000-1900W/m.k thermal conductivity;High efficiency of heat transfer;
Light weight, Easy Processing ;[Details]
Uses:
9700 Series Thermal Conductive Pad
Features:
Ultra Soft and High Compressibility, Low Thermal Impedance, UL94 V0 Recognized;
3.5 W/m.k；
Uses: